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150/300um mil Min IVH Hole/Land Size PCB Assembly with BGA Components

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150/300um mil Min IVH Hole/Land Size PCB Assembly with BGA Components

  • 150/300um mil Min IVH Hole/Land Size PCB Assembly with BGA Components
  • 150/300um mil Min IVH Hole/Land Size PCB Assembly with BGA Components
  • 150/300um mil Min IVH Hole/Land Size PCB Assembly with BGA Components
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150/300um mil Min IVH Hole/Land Size PCB Assembly with BGA Components

Capabilities overview: Layers: Rigid PCB 2 - 40 + Layers, Rigid-flex PCB 1 - 10Layers Panel Size(max): 21" x 24" PCB Thickness: 0.016" to 0.120" Line & Spaces: 0.003" / 0.003" Inner Layers; 0.004" ...

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BGA Components PCB Assembly

      

OEM PCB Assembly

      
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